Huawei was previously rumored to be working on a new silicon that was only referred to as the ‘Kirin PC Chip.’ While its current name was severely unappealing, the rumored performance of the chipset was the complete opposite, with its multi-core performance said to come close to Apple’s M3. We did predict that it would take a long time for the company to develop this SoC, but we were incorrect in our assessment, at least according to one tipster, who claims that the chipset will launch in May or June and is expected to be found in the new Qingyun notebook family.
Previous Qingyun L540 and Qingyun L420 notebooks featured the underpowered Kirin 9006C, but Huawei could return to the ARM notebook space with a bang
Assuming Weibo tipster Fixed Focus Digital’s words come true, the Kirin PC Chip could materialize as early as this month, though a release may also happen in June. Huawei is said to host an event on May 7, which is the same date as Apple’s ‘Let Loose’ event, so it will be interesting to see how the former Chinese giant attempts to steal some of that spotlight with a bevy of product launches. A new Qingyun notebook range could be a part of the announcements, and with the new Kirin PC Chip, Huawei could effectively reveal the successor to the Kirin 9006C.
The Kirin PC Chip was previously rumored to receive a massive performance boost because Huawei would rely on the Taishan V130 architecture. Other claims, such as the chipset’s GPU performance being close to the Apple M2, were also made, and if any of these rumors are legit, the difference between the Kirin 9006C and the upcoming one will be massive. According to earlier Geekbench 6 results, the Kirin 9006C obtained poor single-core and multi-core results, with the SoC being less capable than Qualcomm’s Snapdragon 8cx Gen 3 in the same test. In this area, Huawei has some significant ground to cover.
The CPU cluster of the Kirin PC Chip was shared by Huawei Central in the latest report, with the silicon said to feature four Taishan large cores, four Taishan middle cores, two large NPU cores, and two micro NPU cores, making it for a capable configuration, at least on paper. However, how it performs and stacks up against the Snapdragon X Elite and Apple’s M3 in public benchmarks is another story that we will save for another day.
News Source: Fixed Focus Digital
