The partnership between Apple and TSMC has enabled both companies to bring out the best when it comes to cutting-edge chips. The Cupertino firm not only attempts to remain ahead of the competition by investing in advanced nodes such as 3nm, but it is also exploring other packaging technologies such as 3DFabric with its foundry partner. Now, according to one rumor, Apple is exploring SoIC (Small Outline Integrated Circuit) packaging, which can bring a multitude of benefits to the table, so let us check out all the details here.
A small-scale pilot test of SoIC packaging is rumored to be underway, but the rumor does not specify which product range Apple is targeting
The tipster Yeux1122 has stated that Apple is actively working to increase its CoWoS (Chip-on-Wafer-on-Substrate) packaging production capacity. However, the technology giant is also working behind closed doors, pursuing next-generation SoIC solutions. While we will discuss what SoIC packaging is and what advantages it touts compared to other alternatives, let us discuss more details the tipster mentioned. For instance, Apple could merge these SoIC chips with hybrid molding, but the latest rumor has not highlighted the positives of this approach.
It is rumored that SoIC chips will undergo a small-scale pilot production run, with proper mass production scheduled for as early as 2025, though the timeline may also reach 2026. SoIC is based on CoWoS and WoW (Multi-Wafer Stacking) packaging technology, and compared to 2.5D solutions, Small Outline Integrated Circuit not only gets a reduction in the overall power consumption, but it can also boast higher densities and increased transfer rates, leading to higher memory bandwidth.
Another benefit is that SoIC packaging results in a lower footprint, giving Apple sufficient freedom to mass produce smaller dies and save up on space. Furthermore, the company can save significant costs, as this technology reduces the price of integrated circuit boards. Unfortunately, the rumor does not mention which product range will be treated to the first SoIC chip, so while we wish to know immediately, Apple will likely take its sweet time in perfecting the design before it is ready for an official launch.
News Source: Yeux1122
